Hannover, Germany – April 17, 2008 - From 24 to 30 April 2008, the international packaging industry will get together in Düsseldorf at the biggest interpack event ever staged. Together with our COPACO partners we will use this platform to present world-class packaging solutions for the perfect POS presentation.
Once again we will turn the spotlight on innovations and creations. We are looking forward to presenting to you how integrated innovation management and trendscouting enables us to identify the requirements of tomorrow`s markets and which solutions we provide in the refering competence fields Smart Packaging, Multisensory Packaging, Design for All as well as Anti-Counterfeiting.
Experience our new packaging concepts like rlc|bodyline and our iF Packaging Award 2008 winner rlc|shapeline. We are especially excited to show the results of our latest innovation rlc|metal effects.
Please join us at our booth on April 25th, starting at 6:00 pm. to celebrate COPACO’S anniversary: “40 YEARS POWER OF SYNERGY”.
For more information on Interpack Processes and Packaging 2008 visit the website at www.mdna.com/shows/interpack.html.
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